Involve them as early as possible in the process.Ĭareful attention needs to be paid to layer pair planning and documentation for drilling and through-hole plating, because blind vias from a rigid surface layer down to an opposing flex-circuit layer will have to be back-drilled and add significant cost and lower yield to the fab process.Use IPC-2223 as your point of reference for design, making sure the fabricator uses the same & related IPC standards - so they are using the same terminology as you.Make sure they collaborate with you on designing your layer stack to fit their particular processes.Make sure your fabricator is capable of building your rigid-flex design.It could boil down to a few golden rules: Fortunately, there are standards we can reference to make sure we are communicating clearly to the fabricator, in particular IPC-2223B (which I am referencing in writing this). When you're preparing documentation, you're essentially telling the fabricator what you want to see in the rigid-flex assembly it’s the most likely part of the process where errors or misunderstandings can cause costly delays. Documenting Your Flex PCB for Manufacturing and Assembly In the coming sections, we'll provide some of the information you should specify in your fabrication documentation, specifically in your fabrication notes and drawings so that you can prevent misunderstandings when you transition to production. For rigid-flex, the fabrication concerns and expectations are a bit different from those expected in rigid PCBs. You'll have one last set of tasks to complete before your job as a designer is complete: prepare the manufacturing documentation your manufacturer needs to begin production on your rigid-flex circuit board. Anytime you design a new product that will be manufactured at scale, your job suddenly shifts from knowing everything about the design to knowing everything about the manufacturing process.
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